Old Web
English
Sign In
Acemap
>
authorDetail
>
Lisa Caravello
Lisa Caravello
Direct bonding
Optoelectronics
Wafer
Materials science
Electrical engineering
2
Papers
1
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
(Invited) AlGaN Transistors for Digital Logic Applications in High-Temperature Environments
2021
Brianna Klein
Andrew A. Allerman
Nicholas Hines
Christopher D. Nordquist
Andrew M. Armstrong
Michael S. van Heukelom
Anthony Rice
Victor Patel
Jennifer Pipkin
Rebecca DeBerry
Lisa Caravello
Mary Rosprim
Vincent M. Abate
Samuel Graham
Robert Kaplar
Show All
Source
Cite
Save
Citations (0)
Strategies relating to CMP for die to wafer interconnects utilizing hybrid direct bonding
2020
ECTC | Electronic Components and Technology Conference
Jonatan A. Sierra-Suarez
John Mudrick
Crystal C. Sennett
T. A. Friedmann
Shawn Arterburn
Matthew B. Jordan
Lisa Caravello
Jordan E. Gutierrez
M. David Henry
Show All
Source
Cite
Save
Citations (1)
1