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Chang-Yi Lan

Siliconware Precision Industries Company, Ltd.

2

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18

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Cu pillar exposed-die molded FCCSP for mobile devices

2012 ECTC | Electronic Components and Technology Conference
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A study of board level reliability test with bump structure of WLCSP lead-free solder joints

2007 IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
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