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T N Nguyen
T N Nguyen
Delft University of Technology
Materials science
Polymer
Self-assembly
Conductive polymer
Nanotechnology
4
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54
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Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires
2004
Journal of Micromechanics and Microengineering
C. Videlot
Jörg Ackermann
Frédéric Fages
T N Nguyen
Lianwei Wang
P.M. Sarro
D Crawley
Konstantin Nikolic
M Forshaw
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Citations (4)
High aspect ratio through-wafer interconnections for 3D-microsystems
2003
MEMS | International Conference on Micro Electro Mechanical Systems
Lianwei Wang
A. Nichelatti
H. Schellevis
C.R. de Boer
Cassan C. C. Visser
T N Nguyen
P.M. Sarro
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Citations (26)
Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnection applications
2003
Applied Surface Science
Jörg Ackermann
C. Videlot
T N Nguyen
Lianwei Wang
P.M. Sarro
D Crawley
Konstantin Nikolic
M Forshaw
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Citations (14)
3D molecular interconnection technology
2003
Journal of Micromechanics and Microengineering
D Crawley
Konstantin Nikolic
M Forshaw
Jörg Ackermann
C. Videlot
T N Nguyen
Lianwei Wang
P.M. Sarro
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Citations (10)
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