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YoungHyuk Jeong
YoungHyuk Jeong
STATS ChipPAC Ltd
Electronic engineering
Thermal expansion
Dielectric
Materials science
Dielectric loss
2
Papers
23
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0
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Advanced Laminate Carrier Module Warpage Considerations for 32nm Pb-free, FC PBGA Package Design and Assembly
2011
Edmund Blackshear
Thomas E. Lombardi
Frank L. Pompeo
Jean Audet
KyungMooon Kim
YoungHyuk Jeong
Joonyoung Choi
JoonYeob Lee
ChangWoo Park
Kyoji Kondo
Shunichiro Matsumoto
Yoichi Miyazawa
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Citations (10)
Advanced laminate carrier module warpage considerations for 32nm pb-free, FC PBGA package design and assembly
2011
ECTC | Electronic Components and Technology Conference
Edmund Blackshear
Thomas E. Lombardi
Frank L. Pompeo
Jean Audet
KyungMooon Kim
YoungHyuk Jeong
Joonyoung Choi
JoonYeob Lee
ChangWoo Park
Kyoji Kondo
Shunichiro Matsumoto
Yoichi Miyazawa
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Citations (13)
1