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Matthias Patz
Matthias Patz
IMEC
Materials science
Analytical chemistry
Low-k dielectric
Copper interconnect
Chemical-mechanical planarization
5
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17
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Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects
2004
Microelectronic Engineering
Zs. Tkei
Matthias Patz
M. Schmidt
Francesca Iacopi
Steven Demuynck
Karen Maex
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Citations (13)
Interaction of a variety of ashing plasma with MSQ low-k dielectric
2004
Quoc Toan Le
Matthias Patz
Herbert Struyf
Mikhail Baklanov
Werner Boullart
Serge Vanhaelemeersch
Karen Maex
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Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics
2003
Thomas Abell
Denis Shamiryan
Matthias Patz
Karen Maex
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Citations (1)
Understanding adhesion failure in low-k dielectric stack during Chemical-Mechanical Polishing
2003
MRS Proceedings
Francesca Iacopi
Dominiek Degryse
Ingrid Vos
Matthias Patz
Karen Maex
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Characterisation of JSR's spin-on hardmask FF-02
2003
Microelectronic Engineering
Arabinda Das
Quoc Toan Le
Yukiko Furukawa
V.H. Nguyen
Valentina Terzieva
F.K. de Theije
Caroline Whelan
Mireille Maenhoudt
Herbert Struyf
Zs. Tokei
Francesca Iacopi
Michele Stucchi
L. Carbonell
Ingrid Vos
Hugo Bender
Matthias Patz
Gerald Beyer
M. Van Hove
Karen Maex
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Citations (2)
1