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O. Wittler

Technical University of Berlin

19

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147

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Condition monitoring for failure monitoring of power electronic assemblies

2019
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Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques

2016 EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
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DoE simulations and measurements with the MicroDAC stress chip for material and package investigations

2010 ESTC | Electronics System-integration Technology Conference
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Hermeticity of eutectic bond layers for sensor packages on wafer-level

2010 ESTC | Electronics System-integration Technology Conference
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Characterization of thermal interface materials to support thermal simulation

2006 arXiv: Materials Science
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Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon

2006 MRS Proceedings
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Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging

2006
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Thermo-mechanical analysis of advanced electronic packages in early system design

2005 DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
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Design methodology of microstructures for enhanced mechanical reliability

2005 Proceedings of SPIE
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Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study

2004 ITherm | Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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