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Jingyou Jin
Jingyou Jin
Tianjin University
Die (integrated circuit)
Electronic packaging
Materials science
Power (physics)
Optoelectronics
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Pressureless Sintered-silver Die-attach at 180C for Power Electronic Packaging
2021
IEEE Transactions on Power Electronics
Meiyu Wang
Yun-Hui Mei
Jingyou Jin
Shi Chen
Xin Li
Guo-Quan Lu
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