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Thuy Tran-Quinn
Thuy Tran-Quinn
IBM
Materials science
Electronic engineering
Electrical engineering
Delamination
Composite material
3
Papers
2
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0
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3Di DC-DC Buck Micro Converter with TSVs, Grind Side Inductors, and Deep Trench Decoupling Capacitors in 32nm SOI CMOS
2016
ECTC | Electronic Components and Technology Conference
John M. Safran
Giri N. K. Rangan
Venkata Nr Vanukuru
Sandeep Torgal
Vikram Chaturvedi
K P Sarath Lal
Shahid Butt
Gary W. Maier
Alberto Cestero
Thuy Tran-Quinn
Joyeeta Nag
Sami Rosenblatt
Norman Robson
Matthew Angyal
Troy L. Graves-Abe
Daniel George Berger
James Pape
Subramanian S. Iyer
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3D integration ESD protection design and analysis
2015
EOS/ESD | Electrical Overstress/Electrostatic Discharge Symposium
Souvick Mitra
Ephrem G. Gebreselasie
You Li
Robert J. Gauthier
Joel Abraham Silberman
Christy S. Tyberg
Katsuyuki Sakuma
Thuy Tran-Quinn
Koushik Ramachandran
Matthew Angyal
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Defect mitigation of plasma-induced delamination of TiW/Cu from SiN x layer in thin si interposer processing with glass carriers
2015
ECTC | Electronic Components and Technology Conference
Vijay Sukumaran
Thuy Tran-Quinn
Jorge Lubguban
Dave Webster
Brittany Hedrick
Harry D. Cox
James Wood
Hiroyuki Miyazoe
Hongwen Yan
Eric A. Joseph
Hongqing Zhang
Benjamin Backes
Mark S. Chace
Eric D. Perfecto
Ian D. Melville
Matthew Angyal
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