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Hengyun Zhang
Hengyun Zhang
Singapore Science Park
M.2
Materials science
Composite material
Nozzle
Electronic engineering
1
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13
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Package-level Si-based micro-jet impingement cooling solution with multiple drainage micro-trenches
2014
EPTC | Electronics Packaging Technology Conference
Yong Han
Boon Long Lau
Hengyun Zhang
Xiaowu Zhang
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