Old Web
English
Sign In
Acemap
>
authorDetail
>
Vincent Wei
Vincent Wei
Materials science
Electronic engineering
Ceramic
Electrical engineering
Copper
4
Papers
26
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Crosstalk metrics and the characterization of 1 . 1 m-pixel CIS
2011
Calvin Yi-Ping Chao
Huonian Tu
Kuo-Yu Chou
Po-Sheng Chou
Fu-Lung Hsueh
Vincent Wei
Ren Jie-lin
Biay-Cheng Hseih
Show All
Source
Cite
Save
Citations (0)
Direct plated copper substrate for RF and microwave packaging applications
2011
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Vincent Wei
Show All
Source
Cite
Save
Citations (1)
Direct plated copper technology for high brightness LED packaging
2011
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Heinz Ru
Vincent Wei
Thompson Jiang
Mike Chiu
Show All
Source
Cite
Save
Citations (18)
1