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Jesse Claes
Jesse Claes
Copper oxide
Direct bonding
CMOS
Wafer
Materials science
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Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization
2016
Celso Cavaco
Lan Peng
Simone Lavizzari
Jesse Claes
Nele Van Hoovels
Stefano Guerrieri
Deniz Sabuncuoglu Tezcan
Haris Osman
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