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Sharon Quek
Sharon Quek
Drop impact
Quad Flat No-leads package
Drop test
Chip-scale package
Integrated circuit design
1
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38
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Board level drop test reliability of IC packages
2005
ECTC | Electronic Components and Technology Conference
Chai Tc
Sharon Quek
W.Y. Hnin
E. H. Wong
Julian Chia
Wang Yy
Tan Ym
Lim Ct
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Citations (38)
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