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Saiko Fujii
Saiko Fujii
Tokuyama Corporation
Materials science
Thermal conductivity
Nitride
Composite material
Thermal
3
Papers
1
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AlN filler for high thermal conductive resin materials
2020
ISSM | International Symposium on Semiconductor Manufacturing
Yoshitaka Inaki
Hisamori Inagawa
Saiko Fujii
Isao Masada
Teruhiko Nawata
Yukihiro Kanechika
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High thermal conductivity composite resin sheet filled with large diameter aluminum nitride and aggregated boron nitride
2019
ICEP | International Conference on Electronics Packaging
I. Masada
Saiko Fujii
S. Imazumi
K. Fujinami
Yukihiro Kanechika
Teruhiko Nawata
M. Ueda
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High Thermal Conductivity AlN Fillers Using Carbo-thermal-reduction and Nitridation Process
2019
Transactions of The Japan Institute of Electronics Packaging
Akimasa Kuramoto
Yutaka Fukunaga
Yasushi Imoto
Yoshitaka Inaki
Saiko Fujii
Meng Wang
Yukihiro Kanechika
Teruhiko Nawata
Masahide Ueda
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