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Jun Ho Hwang

Seoul National University of Science and Technology

6

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Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball

2018 Applied Surface Science
- Jun Ho Hwang
- Jong-Hyun Lee
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Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles

2017 Archives of Metallurgy and Materials
- Jun Ho Hwang
- Jong-Hyun Lee
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Synthesis of Several Micrometer-Size Cu Particles by a Green Wet Reduction Method

2014 Applied Mechanics and Materials
- Jun Ho Hwang
- Jong-Hyun Lee
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