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Keichi Sueda
Keichi Sueda
Osaka University
Wafer dicing
Laser
Microelectromechanical systems
Composite material
Optoelectronics
2
Papers
2
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0
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Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS
2008
Ieej Transactions on Sensors and Micromachines
Y. Izawa
Yosuke Tsurumi
Shuji Tanaka
Hideyuki Kikuchi
Keichi Sueda
Yoshiki Nakata
Masayoshi Esashi
Noriaki Miyanaga
Masayuki Fujita
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Citations (2)
Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS : Separation Method of Glass Layer
2008
The transactions of the Institute of Electrical Engineers of Japan.A
Y. Izawa
Yosuke Tsurumi
Shuji Tanaka
Hideyuki Kikuchi
Keichi Sueda
Yoshiki Nakata
Masayoshi Esashi
Noriaki Miyanaga
Masayuki Fujita
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