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N. M. Shaffiar
N. M. Shaffiar
Universiti Teknologi Malaysia
Soldering
Ball grid array
Fracture mechanics
Commercial software
Structural Fracture Mechanics
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Fatigue fracture process of lead-free solder joints in BGA package
2012
M. N. Tamin
N. M. Shaffiar
Z.B. Lai
Wei Keat Loh
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