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Sukhadha Viswanathan
Sukhadha Viswanathan
Composite material
Materials science
Electronic engineering
Electronic packaging
Inductance
3
Papers
5
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0
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Glass in Electronic Packaging and Integration: High Q Inductances for 2.35 GHz Impedance Matching in 0.05 mm Thin Glass Substrates
2018
ECTC | Electronic Components and Technology Conference
Wu Zihan
Sukhadha Viswanathan
Matthias Jotz
Holger Maune
M. Jost
P. Markondeya Raj
Venkatesh Sundaram
Rao Tummala
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Citations (2)
High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper-Metallized Through-Package-Vias (TPVs) in Ultra-Thin Glass Interposers
2017
ECTC | Electronic Components and Technology Conference
Sukhadha Viswanathan
Tomonori Ogawa
Kaya Demir
Timothy Huang
P. Markondeya Raj
Fuhan Liu
Venky Sundaram
Rao Tummala
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Electrical modeling , design and high-frequency characterisation of through-package-vias in ultra-thin 3d glass interposers
2017
Sukhadha Viswanathan
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