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Dong-Suk Han

Hanyang University

24

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232

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Effects of plasma pretreatment on the process of self-forming Cu–Mn alloy barriers for Cu interconnects

2018 AIP Advances
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Improvement in Device Performance of a-InGaZnO Transistors by Introduction of Ca-Doped Cu Source/Drain Electrode

2015 IEEE Electron Device Letters
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Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc–Tin Oxide Thin-Film Transistors

2015 Journal of Electronic Materials
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Highly stable hafnium–tin–zinc oxide thin film transistors with stacked bilayer active layers

2015 Current Applied Physics
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Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating

2014 Surface & Coatings Technology
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Effective contact resistance of zinc-tin oxide-based thin film transistors.

2014 Journal of Nanoscience and Nanotechnology
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Al2O3/TiO2 multilayer thin films grown by plasma enhanced atomic layer deposition for organic light-emitting diode passivation

2014 Thin Solid Films
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Self-forming Al oxide barrier for nanoscale Cu interconnects created by hybrid atomic layer deposition of Cu–Al alloy

2014 Journal of Vacuum Science and Technology
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Self-forming barrier characteristics of Cu–V and Cu–Mn films for Cu interconnects

2013 Thin Solid Films
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Improvement in the negative bias stability of zinc oxide thin-film transistors by hafnium doping

2013 Current Applied Physics
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Citations (12)