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Yin Tang
Yin Tang
Dow Corning
Materials science
Chemistry
Polymer chemistry
Thermal copper pillar bump
Thermal
6
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A study balancing physical properties for an optimized thermal interface material
2015
EPTC | Electronics Packaging Technology Conference
Lyndon Larson
Xiao Dong Wang
Yin Tang
Adriana Zambova
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Fundamental investigation of lid interactions with TIM1 and adhesive materials for advanced flip chip packaging
2015
ECTC | Electronic Components and Technology Conference
Lyndon Larson
Yin Tang
Adriana Zambova
Cassandra Hale
Sushumna Iruvanti
Taryn J. Davis
Hai P. Longworth
Richard Langlois
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Engineered thermal interface material
2014
ECTC | Electronic Components and Technology Conference
Lyndon Larson
Yin Tang
Loren Dean Durfee
Cassandra Hale
David Plante
Sushumna Iruvanti
Rebecca N. Wagner
Taryn J. Davis
Hai P. Longworth
Annique Lavoie
Richard Langois
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Polyorganosiloxanes fonctionnels agrégés, procédés pour former ceux-ci et procédés pour leur utilisation
2014
Jing Jiang
Kristen Steinbrecher
Yin Tang
James Tonge
Lauren Tonge
Afrooz Zarisfi
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Compositions de silicone durcissables comprenant des polyorganosiloxanes fonctionnels agrégés et des diluants réactifs avec la silicone
2014
Jing Jiang
Yin Tang
James Tonge
Afrooz Zarisfi
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