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Helene Lavoie
Helene Lavoie
IBM
Packaging engineering
Materials science
Manufacturing engineering
Low-k dielectric
Creep
2
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9
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From Leaded to Lead Free Assembly and New Packaging Technology Challenges
2007
ECTC | Electronic Components and Technology Conference
Helene Lavoie
Marie-Claude Paquet
Julien Sylvestre
Sylvain Ouimet
Eric Duchesne
Stephane Barbeau
Marco Gauvin
Valerie Oberson
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Citations (8)
Expérience d'intégration des personnes atteintes de déficience sensorielle profonde : rapport d'évaluation /
1986
Helene Lavoie
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Citations (1)
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