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Thomas Workman

10

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27

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Low Temperature Hybrid Bonding for Die to Wafer Stacking Applications

2021 ECTC | Electronic Components and Technology Conference
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Die to Wafer Hybrid Bonding and Fine Pitch Considerations

2021 ECTC | Electronic Components and Technology Conference
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Die to Wafer Stacking with Low Temperature Hybrid Bonding

2020 ECTC | Electronic Components and Technology Conference
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Die to Wafer Hybrid Bonding: Multi-Die Stacking with Tsv Integration

2020
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Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study

2019
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