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Jennifer Muncy

IBM

9

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27

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Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes

2012 ASMC | Advanced Semiconductor Manufacturing Conference
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Multi-terminal low inductance capacitor delamination failure

2010 ECTC | Electronic Components and Technology Conference
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Chip Package Interaction for 65nm CMOS Technology with C4 Interconnections

2007 IITC | International Interconnect Technology Conference
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Modelling reliability of flip chip on board assemblies implementing a correction function approach comparing analytical and finite element techniques

2004 IEMT | International Electronics Manufacturing Technology Symposium
- Jennifer Muncy
- Daniel F. Baldwin
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