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Harumi Yagi
Harumi Yagi
Electronic packaging
Engineering
Soldering
Product design
Circuit design
2
Papers
3
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Lead-Free Solders Property and Reliability of Electronics Packaging
2002
Harumi Yagi
Osamu Higashi
Masayuki Ochiai
Yoshihisa Kamiya
Hitoshi Honma
Masayuki Kitajima
Tsuyoshi Yamamoto
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The development of assembly technology for Lead-free low temperature solder
2000
Tsuyoshi Yamamoto
Kiyotaka Seyama
Harumi Yagi
Osamu Higashi
Takashi Kanda
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Citations (2)
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