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M. Schulz-Ruthenberg
M. Schulz-Ruthenberg
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Optoelectronics
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Materials science
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Through Glass Vias for a hermetically sealed high frequency applications
2019
K. Kröhnert
M. Wöhrmann
T. Galler
T. Chaloun
C. Waldschmidt
M. Schulz-Ruthenberg
Norbert Ambrosius
Roman Ostholt
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Through Glass Vias for a hermetically sealed high frequency applications
2019
K. Kröhnert
M. Wöhrmann
T. Galler
T. Chaloun
C. Waldschmidt
M. Schulz-Ruthenberg
Norbert Ambrosius
Roman Ostholt
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Cite
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Through Glass Vias for a hermetically sealed high frequency applications
2019
K. Kröhnert
Wöhrmann M
T. Galler
T. Chaloun
C. Waldschmidt
M. Schulz-Ruthenberg
N. Ambrosius
R. Ostholt
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