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Akira Okada
Akira Okada
Materials science
Ball grid array
Composite material
Copper
Input/output
4
Papers
7
Citations
0
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2024
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DEVELOPMENT OF PBGA WITH HIGH SPEED I/O
2003
Hideharu Sakoda
Akira Okada
Fumihiko Taniguchi
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プラグ、ジャック、及びコネクタ装置
1998
Junichi Akama
Satoshi Kato
Yasuyuki Miki
Akira Okada
Moriyuki Ueno
Hirofumi Yanagisawa
yasuyuki miki
jou yuki ueno
satoru katou
akira okada
hirofumi yanagisawa
jun'iti akama
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Electrical characterization of a 500 MHz frequency EBGA package
1998
IEMT | International Electronics Manufacturing Technology Symposium
Toshio Hamano
Yoshihiko Ikemoto
Akira Okada
Kenji Asada
Mitsuo Abe
Yoshihiro Kubota
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Mult-layer Plastic BGA Using Copper-core Ball
1996
Mituo Abe
Hiroshi Miyamoto
Akira Okada
Knji Asada
Masae Minamizawa
Yoshihiro Kubota
Toshio Hamano
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