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Chang-Sik Kim
Chang-Sik Kim
Samsung
Electronic engineering
Diode
Power module
Chip
Finite element method
3
Papers
8
Citations
0
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Cu Heavy Wirebonding for High Power Device Interconnection
2013
Baik-Woo Lee
Chang-Sik Kim
Changmo Jeong
Young Hun Byun
Jeong-Won Yoon
Che-heung Kim
Seong-Woon Booh
U In Chung
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A novel and simple fabrication technology for high power module with enhanced thermal performance
2012
VPPC | Vehicle Power and Propulsion Conference
Young Hun Byun
Changmo Jeong
Jeong-Won Yoon
Che-heung Kim
Chang-Sik Kim
Baik-Woo Lee
Seong-Woon Booh
U In Chung
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Citations (6)
Processor-Based Built-in Self-Optimizer for 90nm Diode-Switch PRAM
2007
VLSIC | Symposium on VLSI Circuits
Kyo-Min Sohn
Hyejung Kim
Jerald Yoo
Jeong-Ho Woo
Seungjin Lee
Woo-Yeong Cho
Bo-Tak Lim
Byung-Gil Choi
Chang-Sik Kim
Choong-keun Kwak
Chang-Hyun Kim
Hoi-Jun Yoo
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Citations (2)
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