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Kim Dongjin
Kim Dongjin
Osaka University
Materials science
Microstructure
Sintering
Thermal shock
Shear strength
2
Papers
3
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Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test
2021
Journal of Alloys and Compounds
Chuantong Chen
Zheng Zhang
Kim Dongjin
Tetsuya Sasamura
Yukinori Oda
Ming-Chun Hsieh
Aya Iwaki
Aiji Suetake
Katsuaki Suganuma
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Citations (2)
High heat-density SiC heater chip for thermal characterization of high temperature packaging
2018
Naoki Wakasugi
Shijo Nagao
Kim Dongjin
Katsuaki Suganuma
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Citations (1)
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