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Igor Volov

Columbia University

6

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55

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Pulse-Plating of Copper-Silver Alloys for Interconnect Applications

2012 Journal of The Electrochemical Society
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Chromatography of bis-(3-sulfopropyl) disulfide and its breakdown products by HPLC coupled with electrochemical detection

2011 Journal of Separation Science
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Investigation of Copper Plating and Additive Interactions in the Presence of Fe3+/Fe2+ Redox Couple

2011 Journal of The Electrochemical Society
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Investigation of Cu Plating and Additive Interactions in the Presence of Fe2+/Fe3+ Redox Couple for the TSV Application

2010
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