Old Web
English
Sign In
Acemap
>
authorDetail
>
N. Chevrier
N. Chevrier
STMicroelectronics
Engineering
Copper
Silicon
Wafer
Electronic engineering
3
Papers
18
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Thermo-mechanical assessment of copper and graphite heat spreaders for compact packages
2016
THERMINIC | International Workshop on Thermal Investigations of ICs and Systems
R. Prieto
Jean-Philippe Colonna
Perceval Coudrain
N. Chevrier
K. N. Assigbe
S. Cheramy
A. Farcy
Show All
Source
Cite
Save
Citations (2)
Warpage reduction using dielectric layers stress tuning: From analytical model to 3D integration of large die on ceramic substrate
2016
Electronics System-integration Technology Conference
C. Ferrandon
B. Kholti
Laetitia Castagné
F. Casset
R. Franiatte
D. Mermin
G. Simon
G. Imbert
Sébastien Petitdidier
F. Bailly
P. Chevalier
L. Toffanin
N. Chevrier
Jp. Pierrel
Show All
Source
Cite
Save
Citations (1)
3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies
2013
ECTC | Electronic Components and Technology Conference
Perceval Coudrain
David Henry
A. Berthelot
J. Charbonnier
S. Verrun
R. Franiatte
N. Bouzaida
G. Cibrario
Francis Calmon
Ian O’Connor
T. Lacrevaz
L. Fourneaud
B. Flechet
N. Chevrier
A. Farcy
O. Le-Briz
Show All
Source
Cite
Save
Citations (15)
1