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T.E. Bunette
T.E. Bunette
Ceramic
Soldering
Capacitive sensing
Electronic packaging
Ball grid array
2
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8
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Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array
1994
D.R. Banks
T.E. Bunette
R. D. Gerke
E Mammo
S. Mattay
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Citations (4)
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