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A. Roshanghias
A. Roshanghias
Materials science
Composite material
Stacking
Direct shear test
Thermal copper pillar bump
2
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A comparative study on direct Cu–Cu bonding methodologies for copper pillar bumped flip-chips
2018
Journal of Materials Science: Materials in Electronics
Y. Ma
A. Roshanghias
A. Binder
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Citations (4)
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