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Mark Ketchen
Mark Ketchen
Materials science
Engineering
Library science
CMOS
Composite material
2
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6
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Thermal modeling of a small extreme power density macro on a high power density microprocessor chip in the presence of realistic packaging and interconnect structures
2004
ECTC | Electronic Components and Technology Conference
Kai Xiu
Mark Ketchen
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Citations (6)
49th Annual Device Research Conference
1991
IEEE Transactions on Electron Devices
Larry A. Coldren
Sam Shichijo
Bob Calawa
Bart Van Zeghbroeck
Peter Asbeck
Thomas N. Jackson
Dennis Rathman
Joe C. Campbell
Mark Ketchen
Jim Rosenberg
Paul Chow
Wolfgang Fichtner
Umesh K. Mishra
Eiji Takeda
John Hayes
Hajime Imai
Jim Pfiester
Kang Wang
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