Old Web
English
Sign In
Acemap
>
authorDetail
>
S. Sinha
S. Sinha
Ferdinand-Braun-Institut
Electronic engineering
Chip
Insertion loss
Flip chip
Engineering
8
Papers
43
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (5)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Flip-Chip Approach for 500 GHz Broadband Interconnects
2017
IEEE Transactions on Microwave Theory and Techniques
S. Sinha
Ralf Doerner
F.J. Schmuckle
Sirinpa Monayakul
Michael Hrobak
Nils Weimann
Viktor Krozer
Wolfgang Heinrich
Show All
Source
Cite
Save
Citations (8)
サブミリ波フリップチップ相互接続組立のプロセスのロバスト性と再現性【Powered by NICT】
2016
Sirinpa Monayakul
S. Sinha
F.J. Schmuckle
Michael Hrobak
Dimitri Stoppel
Olaf Krüger
B. Janke
Nils Weimann
Show All
Source
Cite
Save
Citations (0)
Flip-Chip Interconnects for 250 GHz Modules
2015
IEEE Microwave and Wireless Components Letters
Sirinpa Monayakul
S. Sinha
C.-T. Wang
Nils Weimann
F.J. Schmuckle
Michael Hrobak
Viktor Krozer
Wilfred John
L Weixelbaum
P. Wolter
Olaf Krüger
Wolfgang Heinrich
Show All
Source
Cite
Save
Citations (12)
Process robustness and reproducibility of sub-mm wave flip-chip interconnect assembly
2015
EPEP | Electrical Performance of Electronic Packaging
Sirinpa Monayakul
S. Sinha
F.J. Schmuckle
Michael Hrobak
Dimitri Stoppel
Olaf Krüger
B. Janke
Nils Weimann
Show All
Source
Cite
Save
Citations (4)
Three-dimensional InP-DHBT on SiGe-BiCMOS integration by means of Benzocyclobutene based wafer bonding for MM-wave circuits
2014
Microelectronic Engineering
Ina Ostermay
A. Thies
Tomas Kraemer
Wilfred John
Nils Weimann
F.J. Schmuckle
S. Sinha
Viktor Krozer
Wolfgang Heinrich
Marco Lisker
Bernd Tillack
Olaf Krüger
Show All
Source
Cite
Save
Citations (6)
1