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Jitske Trevor
Jitske Trevor
Applied Materials
Chemistry
Engineering
CMOS
Plasma etching
Integrated circuit
4
Papers
13
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Additifs gazeux produisant un polymere de paroi laterale pour des procedes de gravure
2000
Raney Williams
Jeffrey D. Chinn
Jitske Trevor
Thorsten Lill
Padmapani C. Nallan
Tamas Varga
Herve Mace
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Interferometry for end point prediction during plasma etching of various structures in complementary metal–oxide–semiconductor device fabrication
1999
Journal of Vacuum Science & Technology B
N. Layadi
S.J. Molloy
Thomas Craig Esry
Thorsten Lill
Jitske Trevor
Michael N. Grimbergen
Jeffrey D. Chinn
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WSi/sub x//poly-Si gate stack etching for advanced dRAM applications
1999
ASMC | Advanced Semiconductor Manufacturing Conference
F. Leverd
L. Loisil
Thorsten Lill
Jitske Trevor
P. Van Holt
L van-Autryve
Tamas Varga
Jeffrey D. Chinn
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Citations (1)
Interferometry for endpoint prediction in gate etching
1999
ASMC | Advanced Semiconductor Manufacturing Conference
N. Layadi
Thorsten Lill
Jitske Trevor
S.J. Molloy
F. Baumann
Michael N. Grimbergen
Thomas Craig Esry
Jeffrey D. Chinn
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Citations (3)
1