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Ryan Patz
Ryan Patz
Applied Materials
Composite material
Porosity
Plasma etching
Materials science
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3
Papers
3
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0
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Plasma Etch Challenges for Porous Low k Materials for 32nm and Beyond
2011
CSTIC | China Semiconductor Technology International Conference
Catherine B. Labelle
Ravi Prakash Srivastava
John C. Arnold
Yunpeng Yin
Masao Ishikawa
Yann Mignot
Hakeem Yusuff
Joseph Linville
David V. Horak
Nicholas C. M. Fuller
Ryan Patz
A. Darlak
Kevin Zhou
Yifeng Zhou
Jeremiah T. Pender
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Porous Low-k Material Etch For 32 nm and Beyond
2008
Bulletin of the American Physical Society
Yifeng Zhou
Qingjun Zhou
Ryan Patz
Hairong Tang
Jeremiah T. Pender
Michael D. Armacost
Catherine Labelle
David V. Horak
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Advances in Etching High-Density Embedded FRAM Structures
2003
Integrated Ferroelectrics
Chris Ying
Reggie Mananquil
Ryan Patz
Amitabh Sabharwal
Ajay Kumar
Francis G. Celii
Mahesh Thakre
Robert Kraft
Scott R. Summerfelt
Theodore S. Moise
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