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Qingwei Liu

Semiconductor Manufacturing International Corporation

32

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52

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Lithography and OPC friendly triple patterning decomposition method for VIA

2017 Proceedings of SPIE
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RET selection on state-of-the-art NAND flash

2015 Proceedings of SPIE
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An automated resource management system to improve production tapeout turn-around time

2013 Proceedings of SPIE
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SRAF Optimization for sub-40nm Technology Node Contact Patterning

2012 CSTIC | China Semiconductor Technology International Conference
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Optimize the OPC control recipe with cost function

2010
- Qingwei Liu
- Liguo Zhang
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Adaptive OPC approach based on image simulation

2009
- Qingwei Liu
- Liguo Zhang
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Transformation procedure from sparse OPC model to grid-based model

2009 Proceedings of SPIE
- Qingwei Liu
- Liguo Zhang
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Mask and wafer evaluation of Sigma7500 pattern generator applied to 65nm logic metal and via layers

2009
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Optimized OPC approach for process window improvement

2008 Proceedings of SPIE
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Pattern Centric OPC Flow : a Special RET Flow with Fast Turn-Around-Time

2008 Proceedings of SPIE
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