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Yuu Nakamuta

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Novel TSV process technologies for 2.5D/3D packaging

2014 ECTC | Electronic Components and Technology Conference
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Scallop Free Si Etching and Low Cost Integration Technologies for 2.5D Si Interposer.

2012
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Low cost TSV integration for advanced packaging technologies

2012 ICSJ | CPMT Symposium Japan
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Mécanisme de source de plasma et appareil de formation de film

2008
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