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Chul Uhm
Chul Uhm
Materials science
Composite material
Wire bonding
Intermetallic
Dopant
3
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46
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Reliability study of low cost alternative Ag bonding wire with various bond pad materials
2009
EPTC | Electronics Packaging Technology Conference
Kyung-Ah Yoo
Chul Uhm
Tae-Jin Kwon
Jong-Soo Cho
Jeong-Tak Moon
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