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Ling-Chen Kung
Ling-Chen Kung
Composite material
Electronic engineering
Eutectic system
Soldering
Materials science
2
Papers
8
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Process control of high density solder bumps by electroplating technology
1999
IEMT | International Electronics Manufacturing Technology Symposium
Szu-Wei Lu
Zhao-Hui Wu
Yuh-Jiau Huang
Ruoh-Huey Uang
Wei-Chung Lo
Hsu-Tien Hu
Yu-Fang Chen
Ling-Chen Kung
Hsin-Chien Huang
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Fine pitch low-cost bumping for flip chip technology
1999
IEMT | International Electronics Manufacturing Technology Symposium
Szu-Wei Lu
Ruoh-Huey Uang
Kuo-Chuan Chen
Hsu-Tien Hu
Ling-Chen Kung
Hsin-Chien Huang
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Citations (8)
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