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M. Stiebing
M. Stiebing
Chemnitz University of Technology
Electronic engineering
Composite material
Materials science
Silicon
Interconnection
4
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15
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Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
2018
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
B. Wunderle
D. May
Uwe Zschenderlein
R. Ecke
M. Springborn
N. Jöhrmann
K. A. Pareek
J. Heilmann
M. Stiebing
J. Arnold
Rainer Dudek
Stefan Schulz
M. J. Wolf
S. Rzepka
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Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
2017
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
M. Stiebing
Dietmar Vogel
W. Steller
M.-J. Wolf
Uwe Zschenderlein
B. Wunderle
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Stress investigations in 3D-integrated silicon microstructures
2016
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
M. Stiebing
E. Lörtscher
W. Steller
D. Vogel
M.-J. Wolf
Thomas Brunschwiler
B. Wunderle
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Challenges in the reliability of 3D integration using TSVs
2015
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
M. Stiebing
D. Vogel
W. Steller
M.-J. Wolf
B. Wunderle
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Citations (11)
1