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I. Limansyah
I. Limansyah
Infineon Technologies
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Electronic engineering
Materials science
System integration
System in package
2
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41
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3D integration of image sensor SiP using TSV silicon interposer
2009
EPTC | Electronics Packaging Technology Conference
M. Juergen Wolf
Kai Zoschke
Armin Klumpp
Robert Wieland
Matthias Klein
L. Nebrich
Andy Heinig
I. Limansyah
W. Weber
O. Ehrmann
Herbert Reichl
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Citations (22)
3D image sensor SiP with TSV silicon interposer
2009
ECTC | Electronic Components and Technology Conference
I. Limansyah
M. J. Wolf
Armin Klumpp
Kai Zoschke
Robert Wieland
Matthias Klein
Hermann Oppermann
L. Nebrich
Andy Heinig
A. Pechlaner
Herbert Reichl
W. Weber
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Citations (19)
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