author-photo

Kyung-Do Kim

Seoul National University

3

Papers

11

Citations

Citation Trend

Filter By

Papers (3) Sort By

Journal Conference Others

A novel method to characterize the effect from the diffusion of Cu in through silicon via (TSV)

2015 IEDM | International Electron Devices Meeting
Show All
- Source
- Cite
- Save
Citations (3)
Effectiveness of a Guard Ring Utilizing an Inversion Layer Surrounding a Through Silicon Via

2015 IEEE Electron Device Letters
Show All
- Source
- Cite
- Save
Citations (5)
A new guard-ring technique to reduce coupling noise from through silicon via (TSV) utilizing inversion charge induced by interface charge

2013 VLSIT | Symposium on VLSI Technology
Show All
- Source
- Cite
- Save
Citations (3)