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Haoxiang Ren
Haoxiang Ren
University of California, Los Angeles
Materials science
Interconnection
Optoelectronics
Die (integrated circuit)
Wafer
4
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Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications
2021
ECTC | Electronic Components and Technology Conference
Yu-Tao Yang
Chaowei Hu
Peng Zhang
Niloofar Shakoorzadeh
Haoxiang Ren
Ni Ni
Kang L. Wang
Subramanian S. Iyer
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A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils
2021
ECTC | Electronic Components and Technology Conference
Guangqi Ouyang
Goutham Ezhilarasu
Henry Sun
Haoxiang Ren
Yu-Tao Yang
Subramanian S. Iyer
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Reliability Considerations for Wafer Scale Systems
2021
ECTC | Electronic Components and Technology Conference
Niloofar Shakoorzadeh Chase
Randall Irwin
Yu-Tao Yang
Haoxiang Ren
Subramanian S. Iyer
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Mechanism and Process Window Study for Die-to-Wafer (D2W) Hybrid Bonding
2021
ECS Journal of Solid State Science and Technology
Haoxiang Ren
Yu-Tao Yang
Guangqi Ouyang
Subramanian S. Iyer
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