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Florian Gaul
Florian Gaul
Substrate (chemistry)
Adhesion
Materials science
Copper
Composite material
4
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2024
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Investigation of a Proactive Glass Filler Removal in IC Substrate Build Up Films and its Effect on Topography and Copper Adhesion Reliability
2019
Stefan Kempa
Wolfgang Friz
Florian Gaul
Ellen Habig
Laurence J. Gregoriades
Roger Massey
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