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Ken Miyairi
Ken Miyairi
Interposer
Electronic engineering
Materials science
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4
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54
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Electrical and morphological characterization for high integrated silicon interposer and technology transfer from 200 mm to 300mm wafer
2013
ECTC | Electronic Components and Technology Conference
Masahiro Sunohara
Ken Miyairi
Kenichi Mori
Kei Murayama
Jean Charbonnier
Myriam Assous
Jean-Philippe Bally
T. Mourier
Stephane Minoret
Denis Mercier
A. Toffoli
F. Allain
Eugénie Martinez
H. Feldis
Gilles Simon
Mitsutoshi Higashi
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Warpage control of silicon interposer for 2.5D package application
2013
ECTC | Electronic Components and Technology Conference
Kei Murayama
Mitsuhiro Aizawa
Koji Hara
Masahiro Sunohara
Ken Miyairi
Kenichi Mori
Jean Charbonnier
Myriam Assous
Jean-Philippe Bally
Gilles Simon
Mitsutoshi Higashi
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Citations (30)
Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects
2012
Ken Miyairi
Masahiro Sunohara
Jean Charbonnier
Myriam Assous
Jean-Philippe Bally
Robert Cuchet
H. Feldis
Kei Murayama
Mitsuhiro Aizawa
Gilles Simon
Mitsutoshi Higashi
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Citations (8)
High density 3D silicon interposer technology development and electrical characterization for high end applications
2012
Electronics System-integration Technology Conference
Jean Charbonnier
Myriam Assous
Jean-Philippe Bally
Ken Miyairi
Masahiro Sunohara
Robert Cuchet
H. Feldis
Nicole Bouzaida
Nathalie Bernard-Henriques
Rachid Hida
T. Mourier
Gilles Simon
Mitsutoshi Higashi
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Citations (15)
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