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J.M. Drynan
J.M. Drynan
Electronic engineering
Integrated circuit
Memory cell
Dram
Intermetallic
4
Papers
9
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Metal capacitor technology for application to merged DRAM-logic devices : Special Issue on Advanced Memory Devices and Technologies
1999
Nec Research & Development
J.M. Drynan
S Kishi
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Merged DRAM-logic in the year 2001
1998
MTDT | Memory Technology, Design and Testing
Philip W. Diodato
L. Noda
Yiu-Huen Wong
J.M. Drynan
C.T. Liu
K H Lee
R. Dail
W.S. Lindenberger
A.C. Dumbri
M.V. DePaolis
J.T. Clemens
W.W. Troutman
M. Nakamae
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A quarter-micrometer interconnection technology using a TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti multilayer structure
1993
IEDM | International Electron Devices Meeting
T. Kikkawa
Hidemitsu Aoki
J.M. Drynan
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A quarter-micrometer interconnection technology using a TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti multilayer structure
1993
IEDM | International Electron Devices Meeting
T. Kikkawa
Hidemitsu Aoki
J.M. Drynan
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