Old Web
English
Sign In
Acemap
>
authorDetail
>
Prameela Susarla
Prameela Susarla
General Electric
Materials science
Chip carrier
Electronics
Flip chip
Electronic packaging
4
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (4)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Support cellulaire, procédés de fabrication et utilisation
2011
Reginald Donovan Smith
Scott Michael Miller
Yosang Yoon
Slawomir Rubinsztajn
Prameela Susarla
Show All
Source
Cite
Save
Citations (0)
Development of No Flow Underfills for Lead-Free Flip Chip Applications
2006
Kaustubh Ravindra Nagarkar
Tan Zhang
David Richard Esler
David Simon
Paul Jeffrey Gillespie
Sandeep Tonapi
Prameela Susarla
Ryan Christopher Mills
Show All
Source
Cite
Save
Citations (0)
Development of no-flow underfill materials and processes for Pb-free flip chip applications
2005
EPTC | Electronics Packaging Technology Conference
Ananth Prabhakumar
Donald Joseph Buckley
Paul Jeffrey Gillespie
S. Mandke
Ryan Rexford Mills
Slawomir Rubinsztajn
Prameela Susarla
Sandeep Tonapi
Show All
Source
Cite
Save
Citations (2)
Oriented Crystallization of Random Copolymers
2000
Prameela Susarla
A. S. Abhiraman
Stephen Michielsen
Show All
Source
Cite
Save
Citations (0)
1