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Jun Tsukano
Jun Tsukano
Electronic engineering
Package on package
Engineering
Manufacturing engineering
Engineering drawing
4
Papers
7
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0
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A novel package-on-package technology using coreless substrate with Cu posts (特集 TCEP2007英文論文集)
2008
Journal of Japan Institute of Electronics Packaging
Kentaro Mori
Katsumi Kikuchi
Shinji Watanabe
Daisuke Ejima
Jun Tsukano
Tomoo Murakami
Shintaro Yamamichi
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A Novel Package-on-Package Technology Using Coreless Substrate with Cu Posts
2008
Journal of Japan Institute of Electronics Packaging
Kentaro Mori
Katsumi Kikuchi
Shinji Watanabe
Daisuke Ejima
Jun Tsukano
Tomoo Murakami
Shintaro Yamamichi
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Carte de câblage, dispositif à semi-conducteurs l'utilisant et leurs procédés de fabrication
2007
Katsumi Kikuchi
Shintaro Yamamichi
Hideya Murai
Takuo Funaya
Kentaro Mori
Takehiko Maeda
Hirokazu Honda
Kenta Ogawa
Jun Tsukano
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Ultra-Thin High-Density LSI Packaging Substrate for Advanced CSPs and SiPs
2005
Microelectronics Reliability
Tadanori Shimoto
Kazuhiro Baba
Koji Matsui
Jun Tsukano
Takehiko Maeda
Kenji Oyachi
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Citations (7)
1