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Jae Seok Yang
Jae Seok Yang
University of Texas at Austin
Physical design
Through-silicon via
Electromigration
Electronic engineering
Computer science
6
Papers
30
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Design for manufacturability and reliability for TSV-based 3D ICs
2012
ASP-DAC | Asia and South Pacific Design Automation Conference
David Z. Pan
Sung Kyu Lim
Krit Athikulwongse
Moongon Jung
Joydeep Mitra
Jiwoo Pak
Mohit Pathak
Jae Seok Yang
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Robust clock tree synthesis with timing yield optimization for 3D-ICs
2011
ASP-DAC | Asia and South Pacific Design Automation Conference
Jae Seok Yang
Jiwoo Pak
Xin Zhao
Sung Kyu Lim
David Z. Pan
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