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Shangying Cai
Shangying Cai
Materials science
Optoelectronics
Substrate (chemistry)
Wafer
Composite material
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Semiconductor device with through molding vias
2014
zhengjunwen
Ronghui Peng
Shangying Cai
Hongjia Cai
Yiquan Deng
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Method to prevent metal pad damage in wafer level package
2011
Bingyin Liu
Mingdong Wu
Ronghui Peng
Honghua Lin
Shangying Cai
Yuanzhi Xie
Xinding Huang
Yaode Huang
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Having anti-adhesion coating removed from the engagement device and method
2011
Bingyin Liu
Licheng Zhu
Honghua Lin
Shangying Cai
Yuanzhi Xie
Ronghui Peng
Lanlin Zhao
Jiaxiong Cai
zhengjunwen
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